by Carl-SolderSplash » Tue Oct 22, 2013 10:40 pm
Hi Bruce,
So far I've gone for packing everything I can in with out optimisation for the demos, the TI stack has a separate build option that strips out some features and requires a much smaller foot print. Also the LPC1347 has built in flash drivers in ROM.
So it may be possible. I've used this chip in other projects and implemented a custom bootloader over serial, NXP detail the ROM drivers in the user manual and have example code.
I would do this with the C version rather than the C++ mbed version though. As far as i know we dont get access to the linker settings with mbed so you couldn't create code that's offset to allow a chained boot loader. Also with mbed's hal layer the foot print would be bigger.
I do want to get a boot loader example up on github that would be the first step, then perhaps once everyone has their wifi dips we can get a few people to collaborate on a network bootloader.